The main factory building of Qingdao semiconductor high-end closed test project with a total investment of 1 billion yuan was successfully capped.

Published: Dec 23, 2020 11:19 (GMT+8)

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[total investment 1 billion yuan Qingdao semiconductor high-end closed test project main factory successfully capped] on December 22nd, the main factory building of Qingdao semiconductor high-end closed test project located in China-Japan (Qingdao) local development cooperation demonstration zone was successfully capped. According to the news of international investment in Qingdao West Coast New area, the total investment of Qingdao semiconductor high-end closed test project is 1 billion yuan, which is a key project at Qingdao city and district level in 2020.

On December 22, the main workshop of Qingdao Semiconductor High-end closed Test Project, which is located in the demonstration zone of local development cooperation between China and Japan (Qingdao), was successfully capped.

According to the news of international investment in Qingdao West Coast New area, the total investment of Qingdao semiconductor high-end closed test project is 1 billion yuan, which is a key project at Qingdao city and district level in 2020. On April 15, through the online "cloud contract", the project landed in the China-Japan (Qingdao) local development cooperation demonstration zone, mainly using the world's leading high-end packaging technology to encapsulate the rapidly growing demand for 5G, artificial intelligence and other application chips.

According to reports, the project takes 176 days from the start of construction to the capping of the main factory building, laying a good foundation for the installation and commissioning of production equipment in 2021, and realizing the signing of the contract in that year, landing in the same year, construction in the same year, and capping in the same year.

It is worth noting that on April 15 this year, Foxconn Technology Group signed a project cooperation agreement with Qingdao West Coast New area in the form of network video, and Foxconn semiconductor high-end closed test project was officially settled in Qingdao.

According to the poster news at that time, the Foxconn semiconductor high-end closed test project, jointly funded by Foxconn Technology Group and Fusion Holdings Group Co., Ltd., will use the world's leading fan-out packaging and wafer bonding stack packaging technology. encapsulate the fast-growing demand for 5G communications, image sensors and artificial intelligence and other application chips. Construction of the project is scheduled to start this year, start production in 2021 and reach production in 2025.

From this point of view, Qingdao semiconductor high-end closed test project or Foxconn semiconductor high-end closed test project.

Semiconductors silicon wafers materials production

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