Bai Zhi third-generation semiconductor 6-inch wafer manufacturing project settled in Pukou, Nanjing

SMM: recently, the 31st China Nanjing Golden Autumn Economic and Trade Fair, the investment of 3 billion yuan of Bai Zhi third-generation semiconductor 6-inch wafer manufacturing project successfully signed a contract with Pukou, Nanjing.

The project is built by Nanjing Baizhi Electronic Technology Co., Ltd., with a total investment of 3 billion yuan and a planned land of 80 mu, to establish the third generation semiconductor epitaxial wafer + device professional OEM, which can undertake domestic and foreign IDM and design house commissioned production orders, connect the domestic upstream and downstream industry chains, and achieve the domestic goal of the third generation semiconductor chips, mainly used in 5G base stations, electric vehicles, radar, fast chargers and so on.

Nanjing Baizhi Electronic Technology Co., Ltd., a third-generation semiconductor epitaxial foundry service provider, recently announced the completion of the Pre-A round of financing, with a total financing amount of more than 100 million yuan.

On June 18, 2019, the third generation semiconductor project of Nanjing Bai Zhi Semiconductor Co., Ltd. officially signed a contract to settle in Nanjing Pukou Economic Development Zone, and then Bai Zhi Electronic Science and Technology was established. The company specializes in the production of silicon carbide and gallium nitride related epitaxial wafers, including GaN on Silicon, GaN on SiC and SiC on SiC, which provide professional and high quality silicon carbide and gallium nitride epitaxial foundry services for high voltage, high power and RF microwave applications.

The previously landed third-generation semiconductor project has a total investment of 1 billion yuan. The project plans to invest in the construction of R & D centers and production lines in Pukou Economic Development District, integrating overseas innovative technologies and domestic industrial resources. Research and development of the third generation semiconductor silicon carbide and gallium nitride epitaxial wafer design and pipe fittings process, the products can be widely used in information, new energy power generation, new energy vehicles, self-driving, rail transit and intelligent Electroweb and other fields.

In addition to the hundred knowledge project, the Nanjing Zhongjiao Future Core City project, the Feien MEMS pressure sensor industrialization project and the Miankun Electronic Information Manufacturing Park project are also on the ground at the Golden Fair.

The "Nanjing Zhongjiao Future Core City" project is located in China's first "pan-IC design + research and development of new infrastructure + industrial finance + science and technology industrialization" central enterprise industrial ecological highland, cultivate new infrastructure central enterprise scene incubator, and focus on national scientific research projects and applications, pan-integrated circuit design and industrial finance projects of the future core valley to be invested and operated. Advanced manufacturing projects such as new energy vehicles and silicon-carbon anode materials have been introduced into the manufacturing base, and TOD in Yangliu County is located in mass entrepreneurship and innovation Incubator Center, characteristic Ocean City and other supporting projects. The total investment is about 12 billion yuan and the construction scale is about 900000 square meters.

Wuhan Feien Microelectronics Co., Ltd. will invest 1 billion yuan to set up a subsidiary (Nanjing Feien Microelectronics Co., Ltd.) in the park, set up East China headquarters, set up MEMS chip design team, new packaging exhibition line, calibration and testing factory and sales and service center, and will build 10,000-class clean room, R & D laboratory, semi-automatic production line, automatic production line and joint office. After all the project is put into production, the annual sales income is expected to be not less than 1 billion yuan, and the annual tax is not less than 70 million yuan.

The project of Zengkun Electronic Information Manufacturing Park will cover an area of 89 mu to build a manufacturing industry park based on electronic information manufacturing and intelligent manufacturing industries. The main business scope includes: Park construction, enterprise investment promotion, park management, enterprise services.