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China Enfei successfully developed Ultra-thin Electrolytic Copper foil
Sep 7,2020 17:25CST
translation
Recently, China Nonferrous Engineering Co., Ltd. and China Enfei Engineering and Technology Co., Ltd. wet process high-performance electrolytic copper foil R & D team successfully developed 4 micron ~ 6 micron ultra-thin double light electrolytic copper foil products, indicating that the company has mastered the complete electrolytic copper foil product development technology covering the production process and equipment.
The content below was translated by Tencent automatically for reference.

SMM Network News: recently, China Nonferrous Engineering Co., Ltd. and China Enfei Engineering Technology Co., Ltd. wet process high-performance electrolytic copper foil research and development team successfully developed 4 micron ~ 6 micron ultra-thin double light electrolytic copper foil products, indicating that the company has mastered the complete electrolytic copper foil product development technology covering the production process and equipment.

As one of the deep processing products of copper, electrolytic copper foil is an important basic raw material in the electronic communication industry. However, China is faced with the problem of surplus of low-end copper foil products and dependence on import of high-end electrolytic copper foil products, and the related production technology needs to be improved urgently. At present, the thickness of ultra-thin copper foil products of domestic production enterprises is mainly 6 microns ~ 9 microns, the tensile strength is 300 microns ~ 450 microns, the elongation is more than 3%, and the rough surface profile Rz is less than 2 microns. The Chinese Enfei high-performance electrolytic copper foil research and development team has trial-produced ultra-thin double-sided smooth copper foil products of less than 6 microns and a minimum of 4 microns using raw foil machines and new electrolytic copper foil electrolyte formulations that are independently developed and designed with patented technology. the surface roughness, tensile performance, elongation and other properties of copper foil meet the performance standards of existing electrolytic copper foil. The copper crystal on the surface of the ultra-thin electrolytic copper foil trial-produced by the R & D team is dense and uniform, smooth and without pinholes, the surface roughness Ra is less than 0.35um, and the Rz is less than 2 microns. The tensile strength of the 4-micron ultra-thin copper foil is up to 408 MPA, and the elongation is up to 9.5%.

After years of efforts, the copper foil R & D team started with the electrolyte formula and production process of electrolytic copper foil products, and broke through its own professional restrictions through important nodes such as electrolytic copper foil device, which is the bottleneck of electrolytic copper foil product development. from scratch and self-reliance, we have independently designed and developed the raw foil machine, which is the key equipment for the production of electrolytic copper foil. At present, the company has applied for 4 related invention patents.

The successful development of China Enfei ultra-thin electrolytic copper foil fully demonstrates the company's outstanding advantage of combining engineering expertise with the research and development of high-tech materials, and is another breakthrough in the field of high-tech new materials in China.

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