[SMM tin brief review] intra-day tin rise in Shanghai should be cautious about the impact of Sino-US relations.

Published: Jul 22, 2020 17:42

SMM, July 22nd:

The main 2009 contract of Shanghai tin opened at 142170 yuan / ton last night. After opening, it rose slightly and then fluctuated down, and opened at 142010 yuan / ton in the morning. After opening, the short positions left Shanghai tin market to pull up slightly, then the bulls entered the market, and Shanghai tin concussion rose. In the afternoon, it hit the intraday high of 143770 yuan / ton. After reaching the peak, it pulled back and closed at 142790 yuan / ton, up 1330 yuan / ton, or 0.94%. The trading volume was 40806 lots, and the position volume was 26738 lots, a decrease of 884%. It's a positive line. It is necessary to guard against the impact of Sino-US relations on the market. In the short term, bulls' risk aversion and pessimistic expectations on the macro-economy may cause greater pressure on the tin in Shanghai. The upper pressure level is expected to be around 144000 yuan / ton. The lower support level is around 141500 yuan / ton, the 10-day moving average.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn
Related News
Data: SHFE, DCE market movement (Mar 13)
Mar 13, 2026 15:57
Data: SHFE, DCE market movement (Mar 13)
Read More
Data: SHFE, DCE market movement (Mar 13)
Data: SHFE, DCE market movement (Mar 13)
The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 13 Mar , 2026
Mar 13, 2026 15:57
Center of the Most-Traded SHFE Tin Contract Moves Lower, Transactions Slightly Softened Amid Structural Divergence in End-Use Demand [SMM Tin Midday Review]
Mar 13, 2026 11:53
Center of the Most-Traded SHFE Tin Contract Moves Lower, Transactions Slightly Softened Amid Structural Divergence in End-Use Demand [SMM Tin Midday Review]
Read More
Center of the Most-Traded SHFE Tin Contract Moves Lower, Transactions Slightly Softened Amid Structural Divergence in End-Use Demand [SMM Tin Midday Review]
Center of the Most-Traded SHFE Tin Contract Moves Lower, Transactions Slightly Softened Amid Structural Divergence in End-Use Demand [SMM Tin Midday Review]
[SMM Tin Midday Review: Center of the Most-Traded SHFE Tin Contract Moved Lower, Trading Was Slightly Sluggish Amid Structural Divergence in End-Use Demand]
Mar 13, 2026 11:53
[SMM Tin Flash News: Samsung Reportedly Collaborates with NVIDIA to Accelerate R&D of Next-Generation NAND Flash Memory]
Mar 13, 2026 10:08
[SMM Tin Flash News: Samsung Reportedly Collaborates with NVIDIA to Accelerate R&D of Next-Generation NAND Flash Memory]
Read More
[SMM Tin Flash News: Samsung Reportedly Collaborates with NVIDIA to Accelerate R&D of Next-Generation NAND Flash Memory]
[SMM Tin Flash News: Samsung Reportedly Collaborates with NVIDIA to Accelerate R&D of Next-Generation NAND Flash Memory]
According to reports, Samsung Electronics is working with NVIDIA to accelerate the development of next-generation NAND flash memory chips. A joint research team comprising the Samsung Semiconductor Research Institute, NVIDIA, and the Georgia Institute of Technology has successfully developed a "physics-informed neural operator" model. This model analyzes the performance of ferroelectric-based NAND devices more than 10,000 times faster than existing models, and the related results have been made public. Based on these research findings, Samsung is collaborating with NVIDIA to develop and commercialize ferroelectric NAND flash memory.
Mar 13, 2026 10:08