SHFE Tin to Trade in Recent Range (2017-6-21)

Media reported, citing Samsung Electronics, that Samsung Electronics has opened an advanced semiconductor packaging R&D facility in Yokohama, Japan. Samsung previously announced a plan to invest about 40 billion yen over the five years starting in 2024 to expand the laboratory's research hardware facilities and strengthen its advanced packaging technology capabilities. The advanced packaging laboratory will collaborate with Japanese enterprises, universities, and research institutions to develop next-generation packaging materials and processes. Samsung plans to grow the facility's research staff to more than 100 people by 2027.

According to reports, driven by the continued influx of orders for the 2-nanometer process, with massive orders from US tech enterprises such as Tesla and Broadcom, Samsung Electronics' wafer fab in Taylor, Texas, will begin trial production between the end of this month and early next month. The fab is currently operating at full capacity, and all planned production has been fully booked. It is reported that the yield rate for the 2-nanometer process was around 60% at the beginning of this year, and has recently reached approximately 80%, making it capable of mass production. The fab plans to begin mass production next year.

Qualcomm (QCOM.O) announced today a multi-generation collaboration with Amazon (AMZN.O) to provide customized chips for large-scale AI data centers and jointly advance AI inference. The two companies are also collaborating on optical interconnect solutions of up to 1.6T and future generations. Qualcomm plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation (EDA) workloads, with the goal of shortening chip design cycles. Qualcomm President and CEO Cristiano Amon said that with accelerating AI demand, data center infrastructure requires breakthroughs in both compute and connectivity, and Qualcomm is pleased to collaborate with AWS on customized chips and connectivity solutions. AWS Vice President Prasad Kalyanaraman said this collaboration builds on a strong partnership, with a shared commitment to providing clients with more efficient and cost-effective infrastructure.