China Copper Cathode Output Peaks in March from December 2015, Aluminum Hit Lowest from July 2016

Published: Apr 20, 2017 15:46 (GMT+8)

Save

National Bureau of Statistics (NBS) data show China’s copper cathode output increased 8.5% year-on-year to 764,000 tonnes in March, the highest from December 2015.

SHANGHAI, Apr. 20 (SMM) - National Bureau of Statistics (NBS) data show China’s copper cathode output increased 8.5% year-on-year to 764,000 tonnes in March, the highest from December 2015.

China’s lead production rose 10.1% on a yearly basis to 447,000 tonnes. Zinc output increased 0.8% year-on-year in March to 504,000 tonnes.

Aluminum production increased 2.5% year-on-year to 2.70 million tonnes in March, which is the lowest since July 2016.

China Nonferrous Metals Output Rose 4.0% in March

Here’s Why Hunan Zinc Ore Production is Restricted, SMM Reports

For news cooperation, please contact us by email: sallyzhang@smm.cn or service.en@smm.cn.

Copper Output copper production aluminum output lead output zinc output

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM's internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or for more information, please contact: lemonzhao@smm.cn

For more information on how to access our research reports, please contact:service.en@smm.cn

Related News

47 mins ago

Tight supply coupled with rising sentiment to hold back from selling kept secondary copper prices resilient at high levels [SMM Weekly Review on Secondary Copper Raw Materials Outside China]

47 mins ago

Oct 16, 2026 18:39 (GMT+8)

[Mingyi Electronics Launches High-Aspect-Ratio Gantry Line Electroplating Equipment for AI Servers and IC Substrates]

According to Sanfu New Materials, Mingyi Electronics under Sanfu New Materials has launched a new product series—high-aspect-ratio gantry line electroplating equipment, capable of supporting the production of boards with aspect ratios of 40:1 and above. This series of equipment can be customized according to client needs, is compatible with phosphorized copper balls and insoluble anode systems, and can meet the electroplating requirements for high-end circuit boards such as high-aspect-ratio AI server PCB boards and IC substrates. The equipment has passed various technical tests and has gained recognition from leading server PCB manufacturing clients in China. Multiple equipment orders are already in hand, and the production lines for this series of equipment have entered the production and delivery stage.

Oct 16, 2026 18:39 (GMT+8)

Oct 16, 2026 18:37 (GMT+8)

US Inflation Exceeds Expectations, Combined with Inventory Buildup in China, Copper Prices Rebound Under Pressure [SMM Macro Weekly Review]

Oct 16, 2026 18:37 (GMT+8)