[Advanced Packaging Is Expected to Continue Influencing Semiconductor Design and Manufacturing Processes Next Year, Helping to Optimize Power Consumption While Reducing Costs]
SMM, December 30 - TechInsights today released its 2025 advanced packaging industry outlook: In 2025, advanced packaging is expected to continue influencing semiconductor design and manufacturing processes, helping to optimize power consumption, performance, and area (PPAC) while reducing costs. Artificial intelligence (AI) is driving the demand for larger sizes, more layers, and input/output (I/O) ports in substrates. Currently, interposers are the preferred method for high-performance packaging, but the sustainability of this costly solution is under scrutiny. Options such as panel-level packaging and glass substrates are gaining attention as they can reduce production costs, though challenges such as panel warpage, uniformity, and yield issues remain. Additionally, the automotive market and optoelectronics sector are also expected to achieve growth in the future.
