US AI Infrastructure Boost Plan Impacts Tin Market; Spot Market Quiet Before Holiday [SMM Tin Morning Brief]

Published: Jan 23, 2025 09:05

Save

US Develops AI Infrastructure; Spot Market Becomes Increasingly Quiet Before the Holiday [SMM Tin Morning Brief]

At a White House briefing, Trump announced that the US would open an artificial intelligence research center. Japan's SoftBank Group, Oracle, and OpenAI will invest $500 billion to build AI infrastructure in the US, which may subsequently boost tin-related demand this year.

During yesterday's night session, SHFE tin prices showed a pullback trend. In the futures market, the most-traded SHFE tin contract prices exhibited a high-level consolidation trend, remaining at 249,000 yuan/mt. In the spot market, due to the strong performance of the futures market, spot tin prices did not experience a significant decline...

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn

For more information on how to access our research reports, please contact:service.en@smm.cn

Related News

9 hours ago

Shennan Circuits Reports Strong PCB, Packaging Substrate Business Growth & Project Progress

Shennan Circuits disclosed its investor relations activity record. The PCB business benefited from growing demand for AI computing infrastructure hardware-related products, with factory capacity utilization rates staying high. The packaging substrate business, driven by demand boosts from storage and processor chip substrates, maintained the elevated capacity utilization rate levels seen since Q4 2025. For the Guangzhou packaging substrate project, the capacity ramp-up of BT-type packaging substrates progressed steadily. FC-BGA packaging substrates achieved mass production of products with 22 layers and below, while R&D and sampling of products with 24 layers and above advanced on schedule. The Nantong Phase IV and Thailand factory projects were successfully connected and put into production in H2 2025, with capacity currently ramping up steadily. Capital expenditure in 2026 will primarily focus on PCB and packaging substrate businesses, with key investments directed toward the Wuxi high-speed, high-density, and high-multilayer electronic circuit product project, the Guangzhou packaging substrate factory construction, as well as subsequent payments for the Nantong Phase IV and Thailand factory projects.

9 hours ago

11 hours ago

Data: SHFE, DCE market movement (May 15)

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 15 May , 2026

11 hours ago

12 hours ago

[SMM Tin News Flash: Institution: Micro LED CPO Optical Transceiver Module Market Value Expected to Reach $848 Million by 2030]

According to TrendForce's latest Micro LED industry research, generative AI is driving a rapid climb in demand for high-speed optical communications. Since Micro LED features an energy consumption of only 1-2 pJ/bit and a bit error rate (BER) of less than one ten-billionth, it is expected to become one of the three major short-distance high-speed transmission solutions for intra-rack applications in scale-up data center networks, alongside AEC (Active Electrical Cable) and VCSEL NPO (Vertical-Cavity Surface-Emitting Laser Near-Package Optics). Therefore, TrendForce estimates that the market value of Micro LED CPO optical transceiver modules will reach $848 million by 2030.

12 hours ago