SHFE Tin Stopped Falling and Rebounded with a 2.94% Gain as Macro Suppression and Bottom Support Pulled Against Each Other [SMM SHFE Tin Brief Comment]

Published: Mar 24, 2026 18:33
[SMM SHFE Tin Brief: SHFE Tin Stopped Falling and Rebounded, Closing Up 2.94%, as Macro Suppression and Bottom Support Pulled Against Each Other]

On March 24, 2026, after a sustained decline in the prior period, SHFE and LME tin futures stabilized and moved sideways during the daytime session. The most-traded SHFE tin contract closed at 347,970 yuan/mt, up 2.94%; LME three-month tin was temporarily quoted at $43,950/mt, down 1.24%.

On the macro front, the US Fed maintained the benchmark interest rate unchanged at its March FOMC meeting, raised inflation expectations, and the dot plot indicated one more interest rate cut this year. However, Powell's cautious stance reinforced hawkish market pricing. US Treasury yields and the US dollar continued to rise, and tight dollar liquidity continued to suppress global risk appetite, weighing on US dollar-denominated non-ferrous metals.

China side, economic data for January-February 2026 showed a solid start: industrial value-added growth strengthened to 6.3% YoY from 5.2% in December last year, total retail sales growth rebounded to 2.8% YoY from 0.9%, and fixed asset investment growth turned positive at 1.8% YoY from -15.1%, with declines in infrastructure, manufacturing, and real estate investment all narrowing. During the Two Sessions, the policy front released positive signals, setting the core objective of "making efforts to stabilize the real estate market" and promoting high-quality development of the industry through targeted and pragmatic measures. It also emphasized that "intelligent manufacturing is an important manifestation of the AI era." China's manufacturing sector accounts for nearly one-third of the global total, and intelligent manufacturing serves as both a key pathway for industrial upgrading and an important lever for enhancing international competitiveness. The Chinese market encourages development to consolidate the foundation of domestic demand, but under current macro headwinds, futures remained under pressure and in the doldrums.

Spot side, market trading was relatively quiet today. After futures stabilized, downstream wait-and-see sentiment re-emerged, and purchase willingness was weak. Inventory side, SHFE tin warrants continued destocking. Although current inventory remained at a relatively high level, if the current digestion pace is maintained, continued destocking will provide certain support for the price floor.

In the short term, futures are expected to move sideways. Under macro headwinds, the tin price center may edge lower, but corrective rebounds after the prolonged decline will pull the price center. Going forward, attention should be focused on changes in macro sentiment, downstream procurement pace, and inventory digestion.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn
Related News
Shennan Circuits Reports Strong PCB, Packaging Substrate Business Growth & Project Progress
1 hour ago
Shennan Circuits Reports Strong PCB, Packaging Substrate Business Growth & Project Progress
Read More
Shennan Circuits Reports Strong PCB, Packaging Substrate Business Growth & Project Progress
Shennan Circuits Reports Strong PCB, Packaging Substrate Business Growth & Project Progress
Shennan Circuits disclosed its investor relations activity record. The PCB business benefited from growing demand for AI computing infrastructure hardware-related products, with factory capacity utilization rates staying high. The packaging substrate business, driven by demand boosts from storage and processor chip substrates, maintained the elevated capacity utilization rate levels seen since Q4 2025. For the Guangzhou packaging substrate project, the capacity ramp-up of BT-type packaging substrates progressed steadily. FC-BGA packaging substrates achieved mass production of products with 22 layers and below, while R&D and sampling of products with 24 layers and above advanced on schedule. The Nantong Phase IV and Thailand factory projects were successfully connected and put into production in H2 2025, with capacity currently ramping up steadily. Capital expenditure in 2026 will primarily focus on PCB and packaging substrate businesses, with key investments directed toward the Wuxi high-speed, high-density, and high-multilayer electronic circuit product project, the Guangzhou packaging substrate factory construction, as well as subsequent payments for the Nantong Phase IV and Thailand factory projects.
1 hour ago
Data: SHFE, DCE market movement (May 15)
3 hours ago
Data: SHFE, DCE market movement (May 15)
Read More
Data: SHFE, DCE market movement (May 15)
Data: SHFE, DCE market movement (May 15)
The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 15 May , 2026
3 hours ago
[SMM Tin News Flash: Institution: Micro LED CPO Optical Transceiver Module Market Value Expected to Reach $848 Million by 2030]
4 hours ago
[SMM Tin News Flash: Institution: Micro LED CPO Optical Transceiver Module Market Value Expected to Reach $848 Million by 2030]
Read More
[SMM Tin News Flash: Institution: Micro LED CPO Optical Transceiver Module Market Value Expected to Reach $848 Million by 2030]
[SMM Tin News Flash: Institution: Micro LED CPO Optical Transceiver Module Market Value Expected to Reach $848 Million by 2030]
According to TrendForce's latest Micro LED industry research, generative AI is driving a rapid climb in demand for high-speed optical communications. Since Micro LED features an energy consumption of only 1-2 pJ/bit and a bit error rate (BER) of less than one ten-billionth, it is expected to become one of the three major short-distance high-speed transmission solutions for intra-rack applications in scale-up data center networks, alongside AEC (Active Electrical Cable) and VCSEL NPO (Vertical-Cavity Surface-Emitting Laser Near-Package Optics). Therefore, TrendForce estimates that the market value of Micro LED CPO optical transceiver modules will reach $848 million by 2030.
4 hours ago