Gripm Advanced Materials to Develop Interconnect Materials for PCBs, MLCCs

Published: Sep 16, 2025 07:37

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[Silver Powder Listed Company Announcement] Gripm Advanced Materials (688456.SH) revealed on the interactive platform that in its future industrial planning, the company will conduct technological development on products such as micro-nano copper powder, silver powder, silver-coated copper powder, nickel powder, and their pastes to enrich the categories of interconnect materials. These materials can be applied in product areas such as PCBs and MLCCs.

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