[SMM Computing Power Flash] Five 4090 units in east China quoted at 8,500 yuan with 1T memory

Kexiang Co., Ltd. (300903.SZ) announced that the company plans to invest in the construction of a high-end PCB substrate project for AI computing power in the Xiangshuihe Industrial Park, Daya Bay, Huizhou, with a total investment of approximately 2 billion yuan. The project is planned to have a construction period of 2 years, and upon completion, it will add capacity of 46,000 m² of mSAP substrates per year and 1.2 million m² of PCB substrates for AI servers per year.

SMM has learned that five relocatable 910B4 units have been released to the market, with a monthly rental of 18,000 yuan per unit, available for lease in early November. Compared with recent quotes of 19,000–20,000 yuan for the same form factor, this deal is 1,000 to 2,000 yuan lower, a reduction of 5.3%–10%. Compared with online resources at 14,500–15,000 yuan, the relocatable units carry a premium of 3,000 to 3,500 yuan, or about 21%–24%, notably narrower than the previous price spread of 5,000 yuan, or 33%. This model is mainly intended for inference scenarios.

Nvidia unveiled DSX POD, a modular AI factory reference design, at its GTC conference in Berlin on October 21, 2026. The design integrates compute, networking, rack-level power and liquid cooling into a standard shipping container. Each container carries seven Vera Rubin NVL72 racks with 504 Rubin GPUs in total, plus about 20 kilometers of copper cabling and 17 kilometers of scale-out networking installed and tested at the factory; a unit weighs roughly 28 metric tonnes and packs about 10 million components. Where site power, cooling and network connections are ready, on-site deployment time falls from six months to as few as 14 days. The system runs on coolant up to 45 degrees Celsius with dry cooling, which Nvidia estimates saves about 54 million liters of water per day for a 2-gigawatt deployment. Seventeen partners including Dell, HPE, Lenovo, Bull, Schneider Electric, Vertiv and Armada will begin worldwide deliveries in early 2027, moving inter-rack copper wiring from field construction into factory prefabrication.