[SMM Flash] Huawei Ascend 950 AI computing cluster officially launched for commercial use on September 30

During this year's Singapore Tech Week, SuperX, a full-stack AI infrastructure service provider, officially launched its AI Token Platform and AI collaboration applications globally. Core Logic (Token Economy and Distribution): As enterprises integrate an increasing number of different large models (text, image, video, audio), the management cost of connecting to each provider's API separately is extremely high. The platform enables enterprises to uniformly schedule and access more than 100 AI models from over 10 providers through a standardized, OpenAI-compatible unified API on a token basis. Model Plaza & Intelligent Routing: The platform includes a built-in comparison and evaluation environment (Model Plaza), allowing enterprises to select models based on performance and estimated token costs before sending requests. At the same time, intelligent routing dynamically distributes token requests based on region, latency, service availability, and price, significantly optimizing enterprises' AI operational costs.

During Data Centre World Asia 2026, Midea officially launched the industry-first power-cooling hyper-converged technology for AI computing centers, along with related AI Apps and an AI Token platform, directly addressing the power distribution and cooling bottlenecks caused by high-density energy consumption in current computing centers, and significantly reducing PUE (Power Usage Effectiveness) through system-level integration.

Taiwan power equipment and electromechanical integration company Tatung (2371.TW) unveiled its modular AI data center solution TTG AIDC CUBE at a launch event in Taipei on September 30, aiming to compress the traditional two-to-three-year data center build cycle down to 180 days to compute go-live. The solution pre-integrates compute racks, power distribution, cooling and intelligent monitoring into standard 20-foot and 40-foot high-cube containers, and on-site piping and rack assembly can be completed within four weeks of arrival. Performance is guaranteed at a power usage effectiveness (PUE) below 1.3 and Tier 2 or higher reliability. Tatung said its demonstration site already runs two cooling systems, with medium-voltage power supply, transformers and switchgear all of its own make, covering both air-cooled and liquid-cooled racks, with liquid cooling designed for NVIDIA's next-generation Vera Rubin platform. The product targets enterprise self-built compute and data center operators in the 0.5MW to 50MW range and offers high-voltage power and liquid-cooling integration to Taiwan server ODMs.