[SMM Tin News Flash: Huawei: Kirin Mobile Chip Launching This Autumn Will See Significant Performance Improvement]

Published: May 25, 2026 11:08

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On May 25, at the International Symposium on Circuits and Systems (ISCAS 2026), He Tingbo, Board Member and President of the Semiconductor Business Unit at Huawei, stated that the Kirin mobile chip set to debut this autumn is the first to adopt logic folding technology, delivering a significant performance improvement. He Tingbo said that the "Kirin 2026" mobile chip represents the first successful implementation of logic folding technology. "Over the next decade, we will continue to move toward full folding, and even multi-layer folding, continuously optimizing full-stack performance from devices and circuits to chips and systems.

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