China Advances in Diamond Heat Dissipation for High-Performance Chips, Partnering with NVIDIA

Published: Apr 15, 2026 10:41

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As chips evolve toward higher integration and higher power, traditional copper heat dissipation materials can no longer meet stringent thermal management demands. Diamond thermal conductivity can reach four to five times that of copper, making it a key heat dissipation material for resolving chip performance bottlenecks. Currently, China has achieved mass production of large-size diamond wafers, and coupled with the implementation of related cooperation with NVIDIA, diamond heat dissipation has officially moved from the laboratory to the industrialisation stage. Liquid cooling and diamond materials will create synergistic effects, and China's diamond industry, leveraging its globally leading capacity advantages, is expected to embrace broad development prospects.

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