[SMM Tin Flash News: Alibaba Cloud and Kingsoft Computing Power Centers Accelerate Commissioning; Ultra-Large-Scale Computing Power Centers Built on the “Zhenwu” Chip]

At the opening ceremony of the 2026 Jiufengshan Forum, the *Third-Generation Semiconductor Industry Development Report (2025)* was released. In 2025, China's GaN RF electronics market size reached 11.9 billion yuan, up 9.2% YoY, with the largest application field being security and aerospace, which had a market size of approximately 7.2 billion yuan, accounting for 60.7% of the market. In 2025, China's LED industry entered a critical stage of deep adjustment and structural restructuring, with total annual LED output value of approximately 103.7 billion yuan, edging down 4.4% YoY, of which the upstream epitaxial chip segment accounted for 26.8 billion yuan and the midstream packaging segment for 76.9 billion yuan. In 2025, China's third-generation semiconductor power electronics market size was approximately 22.7 billion yuan, up 28.6% YoY, with SiC and GaN power electronic devices achieving a penetration rate of approximately 16.5% in the power semiconductor market.

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 24 Apr , 2026

[SMM Tin Midday Review: The Most-Traded SHFE Tin Contract Fluctuated at Highs, Downstream Enterprises Mostly Took a Wait-and-See Approach with Limited Follow-Through]