TSMC Chiayi AP7 Advanced Packaging Plant May Delay Equipment Installation to Q4 Due to Safety Incidents

Published: Jun 9, 2025 11:23

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TSMC's Advanced Packaging Plant in Chiayi May Postpone Equipment Installation
TSMC's AP7 advanced packaging plant in Chiayi was originally scheduled to install equipment in Q3, but the supply chain has recently received notifications of postponement to Q4. Two safety incidents occurred at the plant site recently, leading to a work stoppage. The first phase of the plant will establish a wafer-level multi-chip module (WMCM) packaging capacity. It is speculated by the outside world that this packaging technology will be first applied to Apple's self-developed chips.

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