GAC Unveils 12 Automotive-Grade Chips in Collaboration with Leading Tech Firms

Published: Apr 12, 2025 22:39
GAC Unveiled 12 Automotive-Grade Chips Today, GAC unveiled multiple automotive-grade chips, jointly developed with ZTE Microelectronics, Yutai Microelectronics, Renxin Technology, Silergy, Geehy, Eswin, Joulwatt, NationalChip, and Meitai. Among them, the C01 chip, co-developed with ZTE Microelectronics, is China's first independently designed next-generation 16-core multi-domain fusion central computing processor chip. The G-T01 chip, developed in collaboration with Yutai Microelectronics, is the first domestic automotive-grade gigabit Ethernet TSN switch chip with the highest capacity in China. The G-T02 chip, jointly developed with Renxin Technology, is the world's first SerDes chip with a bandwidth of up to 16Gbps. The G-K01 chip, developed with Silergy, is the world's first 6-core RISC-V chip that meets the ASIL-D functional safety level.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn