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Shennan Circuits disclosed its investor relations activity record. The PCB business benefited from growing demand for AI computing infrastructure hardware-related products, with factory capacity utilization rates staying high. The packaging substrate business, driven by demand boosts from storage and processor chip substrates, maintained the elevated capacity utilization rate levels seen since Q4 2025. For the Guangzhou packaging substrate project, the capacity ramp-up of BT-type packaging substrates progressed steadily. FC-BGA packaging substrates achieved mass production of products with 22 layers and below, while R&D and sampling of products with 24 layers and above advanced on schedule. The Nantong Phase IV and Thailand factory projects were successfully connected and put into production in H2 2025, with capacity currently ramping up steadily. Capital expenditure in 2026 will primarily focus on PCB and packaging substrate businesses, with key investments directed toward the Wuxi high-speed, high-density, and high-multilayer electronic circuit product project, the Guangzhou packaging substrate factory construction, as well as subsequent payments for the Nantong Phase IV and Thailand factory projects.